Categories
Electronic Components

Chips Act prompts investment in the industry

Since the introduction of the CHIPS Act in early 2020, the US has seen an increase in private investment.

Companies in the semiconductor industry have announced a large quantity of projects to increase the manufacturing capacity across the states. Some of these projects were even underway before the Act was put into law, relying on the eventual introduction of the Act and the accompanying funding.

The varied projects include ones to build, expand or upgrade fabs specialising in different areas. There are also plans for new semiconductor equipment facilities and factories to produce materials for semiconductors.

Thanks to this early action, some projects could be finished as early as 2024. Others, announced after the implementation of the CHIPS Act, will begin construction this year.

What happens next

There are plans for at least 23 new fabs, and 9 expansions to existing facilities. This, in turn, has encouraged investment in equipment and material facilities. Altogether, both fabs and all the surrounding investment, is estimated to come to almost $200 billion.

Alongside the vast amount of investment to be spent on the industry, it could also create around 40,000 jobs. According to a 2021 study, this number of jobs could have a much bigger impact. For every direct employee of the semiconductor industry, an additional 5.7 jobs are supported in the wider economy.

Show me the money

The CHIPS Act provides $280 billion in funding over the next 10 years. Most of this is for scientific R&D and commercialization.

$2 billion of funding will be allocated the Department of Defense, funding research, fabrication and training. Another $500 million will go to the Department of State to work with foreign government partners on supply chain security.

For the last few years the risks of sourcing chips from overseas have been shown in all their glory. Compared to the 37% of global semiconductors made in the US in the 90s, only 12% are made here now. The CHIPS Act was introduced to reduce the reliance on other countries, and boost commerce and employment domestically.

Despite this, some experts say that the CHIPS Act may not be able to cover the costs it intends to. GS Research said due to the higher production costs in the US vs Taiwan, the funding may not cover it. Although they expect the Act will increase production, they do not believe it will make a difference of more than 1% to the US share of global chip capacity.

No matter the cost

There is a lot of uncertainty in the electronics market right now, but you can rely on Lantek. We have a team of experts who can help you source any parts you’re looking for. With our years of experience we are always one step ahead of our competition. We can’t wait to show you what we can do for you, contact us today on 1-973-579-8100 or at sales@lantekcorp.com.

Categories
Electronic Components

Is it possible to make compostable PCBs?

Decades ago we wouldn’t have thought it possible to create printed circuit boards (PCBs). Now, in 2023, we’re discussing the possibility of biodegradable ones.

A research group from the Johannes Kepler University in Austria developed the biodegradable base for the PCBs. The mix consists of beech wood shavings, organise full-grain spelt flour, fine plaster (CaSO4) dust and beech wood-based inoculum.

After storing the mixture in a flat plastic box in a cupboard for a few weeks a tissue grew. The fungal fibres, called mycelium, formed a kind of soft white skin, similar to paper.

A layer of copper or gold is then vapour-deposited onto the mycelium ‘skin’. Then, a laser will cut away the metal where it’s not needed.

A ‘grow-your-own’ circuit

Storing something in a cupboard for a few weeks has significantly lower production costs than regular PCBs. It also bypasses the need for chemicals and minerals that are hazardous to the environment.

With the use of these, too, there is no need to create specialist manufacturing equipment, unlike with biopolymers. They are made from renewable raw materials like starch or milk protein, but have to use an industrial composting plant that operates at a high temperature.

These ‘skins’ can then be mounted with electronic components like a regular PCB.

The mycelium has a very strong structural integrity, while it remains thin and flexible. It has so far been able to withstand about 2,000 bending cycles, it only shows moderate resistance when folded, can insulate electrical currents and can sustain temperatures that reach 250⁰C.

Early days

So far the concept can only be used in simple electronic devices. A multi-layer circuit or more complex electronics are slightly further in the future. Even at this early development stage, though, a prototype has already been attached to a moisture sensor, a Bluetooth chip that sends the sensor signal to a laptop or smartphone, and a special battery.

In the future it is hoped that production of a smoother mycelial skin through a refined formula could increase the possibilities. It could lead to multi-layer PCBs with smaller components.

Once the circuit has been used, it can be unsoldered and put in the compost. The metal used I the conductor paths will be a biproduct left in the soil, but will be nano-particles in unharmful quantities.

Looking for a fun-guy?

Whether you’re ‘growing’ or manufacturing your PCBs, Lantek has the electronic components for you. We specialize in obsolete, hard-to-find, and day-to-day electronic components, and can source components from trusted sources globally. Contact us today to see what Lantek can do for you on sales@lantekcorp.com, or call 1-973-579-8100

Categories
component shortage Covid-19 Electronic Components Supply Chain

Lantek 2022- a year in review

As 2022 comes to an end, we at Lantek are reflecting on the many ups and downs of the year and the great things that will be happening in 2023. 

This year was yet another year of challenges for finding product and then the even bigger challenge to find stock at pricing that customers can afford. Lantek was able to work with many companies this year to help avoid lines down situations. The years of experience from all of our staff
played a major role in that.

Electronica

This past November we were able to meet up with long time and even some new customers at Electronica in Munich. Some conversations were
had about the market and where everyone sees it going but more importantly, it was a chance to just sit and talk face to face with people we haven’t seen since 2018!

Frank Cervino, our GM, said this: “After so many years, catching up with customers and suppliers during these uncertain market
conditions was very beneficial. It was also a pleasure to spend time with the Cyclops Group and be present on the stand.”

Christmas

As our year ends on December 22, we will be having a Christmas lunch brought in for us all to enjoy.

In January, Lantek will be marking its 29th year in business and what a way to celebrate but with our new office and warehouse
space!

We are hoping to be able to start moving product by mid-February.

We will take volunteers to help with that! (If any of you have ever been to NJ in the winter, you will appreciate the challenge this will be)

See you next year!

In closing we would like to wish all of you a very happy holiday season and may your 2023 be a prosperous and positive one!

We will be back in the office on January 3, 2023 for any and all of your electronic component needs. Please contact us at 973.579.8100 or at sales@lantekcorp.com.

Categories
Electronic Components

Electronics to measure climate change

Semiconductors are being used to track and combat the effects of climate change. Their use could help scientists better understand the impact and process global warming has on the planet.

Climate change and global warming are topics that are often discussed in modern society, both by governments and individuals alike. There are certain industries that are thought to be larger contributors to the current situation. However, the electronics industry may be able to help rather than hinder the battle against climate change.

Accelerometers

These electronic components have been used to measure the effects of climate change through trees.

Accelerometers measure the vibration or acceleration of motion of a structure. Inside is a piezoelectric material, which makes an electrical charge proportional to the force caused by the motion.

The electronic device can be used for a variety of things, from spaceships to smartphones. But recently, researchers have been tying them to trees.

These so-called ‘tree fitbits’ can track the timing of tree activities like blooming or the leaves changing. Two ash trees in East Boulder were fitted with high-resolution accelerometers which tracked how they responded to the changing seasons.

The hope is that in the future tree phenology (the study of periodic events in biological life cycles) can be studied in relation to climate change. The accelerometers measured the amount that the trees swayed and the high frequency vibrations of the tree itself. This helps scientists track the phases of the tree (phenophases) as the seasons progress.

The data means that the start and end of each season for the tree, for example flowering in spring, can be measured and compared to data from previous years. The differences can be indicative of climate change and could be used as a warning sign.

Sensors

Miniscule sensors inspired by dandelion seeds could be scattered to track climate change indicators as well. The sensors were produced by a team from the University of Washington in Seattle. The electronic devices are made from polyimide films, and were manufactured using a laser-powered tool. Throughout its structure there are tiny holes, which aids it in floating like a dandelion seed.

The benefit of these tiny sensors means researchers can reach dangerous places without putting themselves at risk. Tracking temperature, humidity and other environmental signals across a large area would be beneficial to climate change research.

On board there are tiny solar panels and a capacitor that can store energy overnight when conditions are not optimal.

Indicators of change?

The future of the planet is not set in stone, and electronic devices can make a difference. Both in prediction and prevention, electronics are aiding us in our efforts. Lantek can provide electronic components for you to make your own change. Trust Lantek to supply you, contact us on sales@lantekcorp.com or 1-973-579-8100

This blog is purely for entertainment and informational purposes, it is in no way instructional.

Categories
Electronic Components

One week until Electronica!

This year one of the largest electronics trade fairs in the world is taking place in Munich, Germany.

Lantek founder has been attending Electronica since it first began, so the convention has always been a highlight of our calendar. We have met many clients and partners through the connections provided to us by Electronica.

The convention is focusing on the promotion of sustainability this year. Bringing the industry together in one location with the aim of “Driving Sustainable Progress”, Electronica hopes to show the role the world that electronics will help, not hinder, sustainability.

The previous Electronica in 2020 was purely virtual, but having hundreds of exhibitors back in Messe München, spread over 13 halls, will be an event to remember.

 In 2018 there were more than 81,000 visitors to the trade fair from 101 countries. 3,124 exhibitors attended the event, we’re hoping for an even more enthusiastic turnout this time around.

In 2021 there was a 9.8% increase in industry revenue from the previous year, at €200 billion, which is astounding progress during the pandemic.

Electronica will have a supporting program full of knowledge and professional talks. During conferences experts will analyse market activity.

The convention has been held every other year since 1964, and has continually grown and evolved over the years.

In the final week leading up to the trade fair, we want to organise meetings with all our clients who are also attending. Whether you are a returning or new customer, we want to show you what Lantek can do for you.

We have the expertise and drive to go the extra mile for you. Whether you are looking to buy or sell, Lantek has a solution for you.

Whether you are a returning customer or are completely new to Lantek, we want to meet you. If you are attending Electronica you can book an appointment with our staff to discuss your needs at Eventbrite now.

Categories
Electronic Components

3D printing of electronic components

We talk a lot about the ways modern technology are a benefit to the electronics industry. There’s no better example of this than the ability to 3D print electronic components.

Print preview

The first 3D printer was invented in the 1980s, and used a technique called stereolithography (SLA). You might recognise the term from photolithography, a process used in the manufacturing of semiconductor wafers. Stereolithography is slightly different, it uses a laser to harden layers of photopolymer successively in a pre-defined shape. Photolithography is for etching patterns onto semiconductor wafers.

SLA is still the most commonly-used method of 3D printing. There are, however, other methods that have come into use, including digital light processing and liquid crystal display.

With the printing of components or circuits that can conduct electricity, special inks that contain conductive nanomaterials are required.

The process

First, a digital model of the desired component is required. This is referred to as a Computer Aided Design, or CAD model. Then a base layer of the material, usually thermoplastics, is formed using fused deposition modelling (FDM).

After this a trace is created, which is the little web of wiring you can see on a regular PCB. These traces need to be much thicker on a 3D-printed board because the nano-inks naturally carry more resistance than copper.

Once this is complete, the additional components of the board are added in layers until it is finished.

Why use 3D printing?

The process of retooling an entire factory setup versus uploading a different design to a single machine are vastly different. Retooling can be a costly and painstaking process, especially if you are manufacturing on a small scale or just prototyping.

The flexibility that comes with 3D printing is also an advantage. Where regular machinery may have limitations, 3D printing could have significantly fewer.

There would also be a reduction in the waste produced by the process. Most of the time, boards are manufactured and then the excess material is cut away. With 3D printing there would be remarkably less waste produced as it only prints what is needed.

3D printing of electronic components is currently used for small batches or for rapid prototyping, but in the future it could easily be used for more complex components and larger batches.

Just a reminder

Although Lantek does not specialise in 3D printers, we do specialise in electronic components of all kinds, and can supply stock as and when you need it. Make Lantek your electronic component supplier.

This blog is meant for informational purposes only and is in no way instructional.

Categories
Electronic Components

The Future of Bioelectronics

Bioelectronics are electronic devices that are specifically used for biological or treatment purposes. Often this circuitry is used as an alternative or to complement medical treatment.

Why are bioelectronics used?

With certain medical issues, medication may not always be the best or easiest choice. There are many pharmaceutical treatments that can have side effects, and some could be unable to use this treatment. A benefit of bioelectronics is that they can be less invasive than the chemical counterparts.

Current bioelectronics

Possibly the most recognisable bioelectronic device is a pacemaker. The surgically-implanted gadget sends small electric pulses through the heart to keep it beating at a steady pace. An Implantable Pulse Generator (IPG) inside the pacemaker contains the electronics and the lithium battery.

Electrocompulsive therapy is also currently used for the treatment of severe depression and other mental health conditions. Instead of being a permanent implant it is a procedure done under anaesthetic.

This kind of treatment could potentially help those who are unable to take the medication. The therapy sends pulses of electric current to the brain which may mitigate certain symptoms of mental health conditions.

Looking to the future

The hope for the future is more conditions can be treated through bioelectronics, like Parkinson’s and epilepsy. Bioelectronics being used for inflammatory conditions, spinal chord injuries and Crohn’s disease are all areas of interest.

A recent innovation has been the use of electronics that imitate skin. Polymer structures and transistor arrays that are flexible and can stick to human skin are currently in development. This could soon be used to extract data from the skin like pulse and blood pressure. The current alternative is gathering this data via a blood test, which is invasive and not instant. Further along the line, the prosthetic ‘skin’ is hoped to help mastectomy patients restore sensation to surgery sites.

We go together

These tiny electrical stimulators could even work in harmony with medicine. Electroceutical treatments could deliver targeted doses of medication to precise sites in the body. The administration method could limit the adverse effects to the rest of the body and could be customisable depending on the patient.

Electroceutical treatments have the potential to be controlled through smart devices. As with other electrical applications, an electronic device could be controlled through a phone or laptop. If this was possible, dosages, or current, could be changed with a more immediate effect than with drugs.

It’s going to take some time

Electronic skin and other innovations are still in the early stages of research and development, and won’t be widely available any time soon. But with the line between electronics and pharmaceuticals already being crossed, we can expect the two industries to become a lot more intertwined.

Categories
Electronic Components

India increasing chip manufacture

In recent years India has been increasing its share in the electronics industry, planning to become a hub in the future.

Currently India has a lot of dependence on imported chips, heavily relying on the Chinese supply chain. One of its goals is to be, in part, autonomous in its chip production. The supply chain issues brought about by covid and other global factors really highlighted this.

But it is not easy to just move production of something so complicated to another country. It would require massive amounts of funding to reshore production.

Make in India

In 2021 the Indian government announced funding equal to $10 billion to improve domestic production over the next 5 years. Several companies have put in bids for the funding, including Vedanta, IGSS Ventures, and India Semiconductor Manufacturing Corp.

The funding is part of the Government of India’s ‘Make in India’ plan, encouraging investment and innovation in the country. Prime Minister of India Narendra Modi announced the initiative in 2014, focusing on 25 sectors including semiconductors and automobiles.

Domestic reliance

One of India’s goals is to move away from reliance on imports, on which they currently spend $25 billion annually. Only 9% of India’s semiconductor needs are met domestically. If production is reshored in part, this would increase local jobs and income for the country.

As it stands, India currently has more of a focus on R&D but don’t have fabs for assembly and testing. The nearby Singapore and manufacturing powerhouse Taiwan provide most of its current stock.

A change in the air, and in shares?

The recent approval of the Chips Act in the US means there may be a shift in industry shares. At the moment America has a 12% share, but if production is re-shored this may impact the Asian market.

However, India and the US, alongside the UAE and Israel plan to form an alliance. With financial aid from the bigger players, the alliance plans to focus on infrastructure and technology.

India was the US’s 9th largest goods trading partner in 2021, with $92 billion in goods trade in 2019. India is also the EU’s 10th largest trading partner, but with domestic semiconductor industry growth this might change.

India’s end equipment market revenue was $119 billion at the end of 2021. Its annual growth rate is predicted to be 19% in the next 5 years.

India is aware of the importance of the semiconductor industry, and set up an India Semiconductor Mission (ISM) in 2021. Its goal is to create a reliable semiconductor supply chain, and to become a competitor against giants like the US.

Relish the competition

India’s potential in the semiconductor industry is increasing, and there is likely to be more investment in the future. It is difficult to tell how much further down the line it would be before India becomes a competitor, but the coming years are sure to be interesting.

Categories
Electronic Components

PCB assembly

Circuit boards, Assemble!

We’re not quite the Avengers, but we do know a thing or two about assembly.

As an electronic component supplier, Lantek works to get customers the electronic components they are looking for. Further down the line, manufacturers construct the printed circuit boards (PCBs) featuring our sourced components.

The assembly of a PCB is a delicate and painstaking process. Just one millimetre of misalignment could mean failure of the whole board. Here’s a brief run-down of what’s involved.

Applying solder paste

The first step in the assembly of a PCB is applying a layer of solder paste. The PCB is overlayed with a stencil, and the solder paste is applied over this. The right amount must be used, as this is spread evenly across the openings on the board.

After the stencil and applicator are removed the PCB will be left and moves on to stage two.

Pick and place

The automated placement of the surface mount devices (SMDs) is done by a ‘pick and place’ robot.

The pick and place machine will have a file containing all of the coordinates for the PCB’s components. Every component will have its X and Y coordinates and its orientation included. This information enables the robot to place components on the layer of solder on top of the PCB accurately.

Reflow soldering

From the pick and place machine the PCBs are directly transferred to a 250⁰ oven, where the solder paste melts and secures the electronic components to the board. Immediately after this, the boards are moved into a cooler to harden the solder joints.

The alternative to reflow soldering is a process called wave soldering. Much like the name suggests, in this method a ‘wave’ of solder moves across the board instead of being pasted on to start with.

Inspection

Once the reflow solder is cooled the PCBs are checked. If anything became misaligned or any solder or components are in the incorrect position, this inspection mitigates the risk to the customer.

When it comes to inspection methods, there are a few options:

Manual inspection – The most basic form of inspection, done with the naked eye. Better for PCBs with through hole technology (THT) and larger components.

Optical inspection – Using high resolution cameras, machines can check large batches of boards for accuracy at a high speed.

X-ray inspection – Give technicians the ability to check inner layers of multi-layer PCBs. This inspection method is usually reserved for more complex boards.

What a Marvel!

Lantek can supply obsolete, day to day, and hard to find components to PCB manufacturers. We can source components efficiently to keep your production line running. Contact us today at sales@Lantekcorp.com, or use the rapid enquiry form on our website.

Categories
Electronic Components

Thermal management of semiconductors

Too hot to handle

Every electronic device or circuit will create heat when in use, and it’s important to manage this. If the thermal output isn’t carefully controlled it can end up damaging, or even destroying the circuit.

This is especially an issue in the area of power electronics, where circuits reaching high temperatures are inevitable.

Passive thermal dissipation can only do so much. Devices called heat sinks can be used in circuits to safely and efficiently dissipate the heat created. Fans or air and water-cooling devices can be used also.

Feelin’ hot, hot, hot!

Using thermistors can help reliably track the temperature limits of components. When used correctly, they can also trigger a cooling device at a designated temperature.

When it comes to choosing a thermistor, there is the choice between negative temperature coefficient (NTC) thermistors, and positive temperature coefficient (PTC) thermistors. PTCs are the most suitable, as their resistance will increase as the temperature does.

Thermistors can be connected in a series and can monitor several potential hotspots simultaneously. If a specified temperature is reached or exceeded, the circuit will switch into a high ohmic state.

I got the power!

Power electronics can suffer from mechanical damage and different components can have different coefficients of thermal expansion (CTE). If components like these are stacked and expand at different rates, the solder joints can get damaged.

After enough temperature changes, caused by thermal cycling, degradation will start to be visible.

If there are only short bursts of power applied, there will be more thermal damage in the wiring. The wire will expand and contract with the temperature, and since both ends of the wire are fixed in place this will eventually cause them to detach.

The heat is on

So we’ve established that temperature changes can cause some pretty severe damage, but how do we stop them? Well, you can’t really, but you can use components like heat sinks to dissipate the heat more efficiently.

Heat sinks work by effectively taking the heat away from critical components and spreading it across a larger surface area. They usually contain lots of strips of metal, called fins, which help to distribute heat. Some even utilise a fan or cooling fluid to cool the components at a quicker speed.

The disadvantage to using heat sinks is the amount of space they need. If you are trying to keep a circuit small, adding a heat sink will compromise this. To reduce the risk of this as much as possible,  identify the temperature limits of devices and choose the size of heat sink accordingly.

Most designers should provide the temperature limits of devices, so hopefully matching them to a heat sink will be easy.

Hot ‘n’ cold

When putting together a circuit or device, the temperature limits should be identified, and measures put in place to avoid unnecessary damage.

Heat sinks may not be the best choice for everyone, so make sure to examine your options carefully. There are also options like fan or liquid-based cooling systems.

Cyclops Electronics can supply both electronic components and the heat sinks to protect them. If you’re looking for everyday or obsolete components, contact Lantek today and see what we can do for you.