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Electronic Components

Process nodes and transistor density

Process nodes and transistor density

There are regular news articles published claiming that the smallest ever process node has been produced. We hear all the time about how small chips are becoming. But how can we measure this progress and does size really matter?

Moore’s Law

The concept of Moore’s Law, loosely, is that the number of transistors in a microchip increases as the size decreases. Originally, when Gordon Moore observed this in 1965, it was thought that the number of transistors would double every two years, but this rapid rate has definitely slowed.

Even so, there is still a constant increase in the number of transistors that can fit on an IC. In 1971, 6 years after the advent of Moore’s Law, there were around 2.3 thousand transistors on a single chip. This sounds like a lot, but we can now fit hundreds of millions onto one.

Nowadays, as it probably always was, it is a race between manufacturers to produce the smallest, most advanced chips. And with the advancement of manufacturing technology, the stakes are higher than ever.

Process nodes

The main method of measuring electronic component progress now is through process nodes. This is the term used for the equipment used for semiconductor wafer production. It describes the minimum repeatable half-pitch (half the distance between two identical features on a chip) of a device. It seems, though, that even this node measurement is no longer accurately used, according to some sources.

Some recent node announcements come from big players in the industry, including Intel, Samsung and TSMC. Taiwan’s largest semiconductor company, TSMC, recently announced that it would be converting its 3nm process node into 1.4nm. Critics, however, were not sure how possible this would be.

Samsung also recently revealed its plans to start manufacturing 2nm process chips in 2025. Additionally, Intel is planning on producing 1.8nm chips in late 2024. Part of the process of developing smaller process nodes is changing the technology involved in production.

What is the measure of a chip?

The method of measuring chips by process nodes is not entirely accurate and can be quite ambiguous. Some people have suggested chip density within the chip would be a better indicator of advancement.

While companies compete to develop the smallest process, some companies are fitting more chips onto bigger nodes. To put it in perspective, Intel’s 7nm process has 237 million per millimetre squared. In comparison, TSMC’s 5nm chip has only 171 million per millimetre squared.

So, although certain chips may have a smaller process node, it doesn’t necessarily reflect how advanced the chip actually is. Intel often uses density to describe its chips, because that is much more beneficial to them.

It’s a process

The question is, should all chips be measured this way instead of in process nodes? If process nodes aren’t accurate to their original definition, the measurements don’t indicate of the highest power chips out there. This might be confusing to consumers when choosing a manufacturer.

It will become increasingly difficult to measure in process nodes as chips get increasingly smaller. Many manufacturers are already making plans for when they begin to measure in Angstrom rather than nanometres. If the changeover from one measurement type to another was not confusing enough, if the measurement method is inaccurate, it may get very complicated.

Apparently, though, transistor count can be just as inaccurate because there is no standard way of counting them. The number of transistors on a single chip design can vary by 33-37% which is quite substantial.

The final node

Unfortunately, there’s no definitive answer on how to measure the advancement of chips anymore. Moore’s Law is far from dead, but is very much up to interpretation these days. Those purchasing or sourcing chips will have to have their wits about them.

For those sourcing chips, contact Lantek. We can source day-to-day or hard-to-find components with ease and can guarantee our customers the best price. Get in touch via sales@lantekcorp.com or call us on 1-973-579-8100 

Categories
Electronic Components

Latest electronic component factory openings

Latest electronic component factory openings

We’ve all heard about the shortages in standard components like semiconductors and chips. Cars, phones and computers, items we use every day, are no longer being produced at the speedy rate we’ve come to expect. The cause of this shortage is, in part, due to the COVID-19 pandemic.

To combat this shortage many electronic component manufacturers have announced the opening or development of new factories. This is especially noticeable in Europe and America, where production has often been outsourced to Asia in the past.

So who are the latest companies expanding operations, and how much are they spending? Check out our quick run-down of factories and when they should open:

Company: Intel

Location: Ohio, USA

Product: Chips

Completion date: 2025

Cost: $20 billion (£14.7 billion)

The latest, and possibly greatest, announcement on our list comes from Intel. The corporation revealed in January that they would be committing to building two chip manufacturing plants in New Albany, Ohio. The move is said to be due to supply chain issues with Intel’s manufacturers in Asia, and should boost the American industry with the creation of at least 3,000 jobs. Construction should begin this year.

Company: Samsung Electronics

Location: Texas, USA

Product: Semiconductors

Completion date: 2024

Cost: $17billion (£12.5billion)

The household name announced late last year that they would begin work on a new semiconductor-manufacturing plant in Taylor, Texas. The Korean company stated the project was Samsung’s largest single investment in America, and is due to be operational by the middle of 2024.

Company: Infineon

Location: Villach, Austria

Product: Chips

Completion date: 2021

Cost: 1.6 billion (£1.3 billion)

After being in construction since 2018, Infineon’s Austrian plant became operational in September last year. The chip factory for power electronics, also called energy-saving chips, on 300-millimeter tin wafers began shipping three months ahead of schedule in 2021, and its main customer base will be in the automotive industry.

Company: Northvolt

Location: Gdańsk, Poland

Product: Batteries

Completion date: 2022

Cost: $200 million (£148 million)

The Swedish battery manufacturer is expanding its operations with a new factory in Poland. While initial operations are supposed to begin this year producing 5 GWh of batteries, it hopes to further develop to produce 12 GWh in future. Northvolt has also just begun operations at its new battery factory in Skellefteå in Sweden.

Company: Vingroup

Location: Hà Tĩnh, Vietnam

Product: Batteries

Completion date: 2022

Cost: $174 million (£128 million)

The Vietnamese electric vehicle manufacturer is due to start production at its new factory later this year, where it will produce lithium batteries for its electric cars and buses. The factory will be designed to produce 10,000 battery packs per year initially, but in a second phase the manufacturer said it will upgrade to 1 million battery packs annually. VinFast, a member of Vingroup, is also planning on expanding operations to America and Germany.

Company: EMD Electronics

Location: Arizona, USA

Product: Gas and chemical delivery systems

Completion date: 2022

Cost: $28 million (£20.7 million)

The member of the multinational Merck Group is expanding operations with the construction of a new factory in Phoenix, Arizona, to manufacture equipment for its Delivery Systems & Services business. The factory is due to be operational by the end of the year, and will produce GASGUARD and CHEMGUARD systems for the company.

A bright future

These electronic component factory openings signal a great increase in business, and will aide in the easing of the component crisis. But it will take a while for these fabs to be operational.

Can’t wait? Lantek is there for all your electronic component needs. We have 30 years of expertise, and can help you where other suppliers cannot. Whether it’s day-to-day or obsolete electronic components, contact us today at sales@lantekcorp.com, or use the rapid enquiry form on our website.